Destructive and non-destructive testing in the area of adhesive bonding
The seminar is intended for those responsible for supervising the manufacturing process, such as designers, developers, quality managers, production planners and application engineers. It is also suitable for bonding manufacturing and laboratory workers.
Seminar content:
Basic methods of mechanical testing (tensile test, peeling test, pressure test, fracturing test and more)
Basic non-destructive testing methods (tap test, ultrasound, spherography, DSC, TGA and others)
Writing of documentation, test procedures and test setup
Assessment and evaluation of test results, test reports
Practical part of the seminar:
Practical exercises – destructive tests according to EN 1465 on the tearing machine, protocol writing
Practical exercises – measurement of surface energy on different substrates, protocol writing
Tap test – identification of defects in reference samples, protocol writing
Contact person:
Mrs. Hana Kysilková
Phone: +420 776 719 286
Email: kysilkova@svv.cz